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  3. Computer On Modules /
  4. COM-HPC /

Computer On Modules

Server

COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE

COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE

COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE

COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE
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Products

2 Total Items

SOM-D580

Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D Module

  • COM-HPC® Server Size D Module
  • Intel® Xeon® D-2700 processors
  • Up to 20 Cores, 30MB LLC Cache, 118W TDP
  • Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC)
  • 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB
  • Supports iManager, Embedded Software APIs, and WISE-DeviceOn
Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D Module
Datasheet

SOM-DH5000

Development Board for COM-HPC® Server pin-out & Size D/E Modules

  • PICMG COM-HPC Server pinout
  • COM-HPC Size D and E compatible
  • Rich extension: 1 PCIe x16, 2 PCIe x8, 5 PCIe x4
  • Integrated BMC supports VGA, Dedicated NIC for IPMI, iKVM
  • 10/25 Gigabit Ethernet support by OCP mezzanine card
  • Visible Debug Utility: BIOS 80 Port and Power State
Development Board for COM-HPC® Server pin-out & Size D/E Modules
Datasheet

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